BOSA
Description
Description
Product Description
◆ The product is uplink 1490nm wavelength/working rate 2.5Gb/s,Downlink 1310nm/work rate 1.25Gb/s point-to-point BOSA components
◆ The sending end adopts DFB laser, and the receiving end adopts APD-TIA diode Tube
◆ Chip information:
LD: 1310nm 2.5Gpbs DFB 4PIN
PT: 1.25Gpbs APD-TIA
◆ Remarks on product structure: SC/PC ferrule assembly, machined/powdered
Final construction, adhesive construction at receiving end, without isolator
Features
◆ Using laser welding solution
◆ Peer-to-peer application
◆ High optical isolation
◆ High Sensitivity APD-TIA
◆ Working temperature: 0~75℃
◆ Pluggable SC BOSA
Standard
◆ Meets Telcordia GR-468 Reliability Test Standard
◆ RoHS 6-item compliant
◆ Meets ROHS (Restriction of Hazardous Substances) standards
◆ Meets GR-326 Connector Qualification Standards
Applications
◆ FTTx
◆ Optical Network
1. Absolute Maximum Ratings
2.Transmitter Electro-Optical Characteristics (TC=25°C, CW)
3.Receiver Electro-Optical Characteristics (TC=25°C, Vcc=3.3V)
4.Dimension Outline
◆ The product is uplink 1490nm wavelength/working rate 2.5Gb/s,Downlink 1310nm/work rate 1.25Gb/s point-to-point BOSA components
◆ The sending end adopts DFB laser, and the receiving end adopts APD-TIA diode Tube
◆ Chip information:
LD: 1310nm 2.5Gpbs DFB 4PIN
PT: 1.25Gpbs APD-TIA
◆ Remarks on product structure: SC/PC ferrule assembly, machined/powdered
Final construction, adhesive construction at receiving end, without isolator
Features
◆ Using laser welding solution
◆ Peer-to-peer application
◆ High optical isolation
◆ High Sensitivity APD-TIA
◆ Working temperature: 0~75℃
◆ Pluggable SC BOSA
Standard
◆ Meets Telcordia GR-468 Reliability Test Standard
◆ RoHS 6-item compliant
◆ Meets ROHS (Restriction of Hazardous Substances) standards
◆ Meets GR-326 Connector Qualification Standards
Applications
◆ FTTx
◆ Optical Network
1. Absolute Maximum Ratings
| Item | Symbol | Unit | Min | Max | Note |
| Operating Case Temperature(case) | TOPR | ℃ | 0 | 75 | |
| Storage Temperature | TSTG | ℃ | -40 | 85 | |
| Storage and Operating Humidity | % | 85 | |||
| Lead Soldering Temperature | TS | ℃ | 260 | ||
| Optical Output Power | dBm | 5 | |||
| Forward Current (LD) | IFLD | mA | 150 | ||
| Reverse Voltage (LD) | VRLD | V | 2 | ||
| MPD Forward Current | IFMPD | mA | 2 | ||
| MPD Reverse Voltage | VRMPD | V | 20 |
2.Transmitter Electro-Optical Characteristics (TC=25°C, CW)
| Item | Symbol | Test Condition | Min. | Typ. | Max. | Unit |
| Threshold Current | ITH | TC=25℃ | --- | -- | 12 | mA |
| TC= 0 ~ 70℃ | --- | -- | 40 | |||
| Forward Voltage | VF | PF=PF (Min), TC =25℃ | --- | --- | 1.9 | V |
| Optical Output power (class B+) | Pf | CW, @ITH+20mA, 25℃ | 1.8 | --- | --- | mW |
| Optical Output power (class B+) | Pf | CW, @ITH+20mA, 0~75℃ | 1 | mW | ||
| --- | --- | |||||
| Optical Output power (class C+) | Pf | CW, @ITH+20mA, 25℃, kink free | 2.4 | --- | --- | mW |
| Optical Output power (class C+) | Pf | CW, @ITH+20mA, 0~75℃ | 1.5 | mW | ||
| Optical Output power (class C++) | Pf | CW, @ITH+20mA, 25℃, kink free | 3.0 | --- | mW | |
| Optical Output powe r(class C++) | Pf | CW, @ITH+20mA, 0~75℃ | 1.8 | mW | ||
| Center Wavelength | λC | CW, TC=0~75℃,TX;1490nm | 1470 | 1490 | 1510 | nm |
| Monitor Current | IM | CW,Pf=Ith+20mA | 100 | --- | 900 | uA |
| Tracking Error | ΔPf/Pf | 0~75℃,CW,Pf (Ith+20mA)@IM hold | -1.5 | --- | +1.5 | dB |
3.Receiver Electro-Optical Characteristics (TC=25°C, Vcc=3.3V)
| Item | Symbol | Test Condition | Min. | Typ. | Max. | Unit |
| Supply Current | ICC | According to TO selection, the range will be different | --- | --- | --- | mA |
| Operation Wavelength | λ | RX:1310nm | 1290 | 1310 | 1330 | nm |
| Saturation Power PIN-TIA | PSAT | 1.25Gbps, PRBS23 BER=10-10,λ=1310nm |
--- | --- | --- | dBm |
| Sensitivity | Sen | 1.25Gbps, PRBS23 BER=10-10,λ=1310nm |
--- | -31 | dBm | |
| Optical Return Loss | ORL | -7 | --- | --- | dB | |
| Optical Crosstalk | XTALK | --- | --- | -45 | dB |
4.Dimension Outline
