Combo
Description
Description
FEATURES
- 1490nm and 1577nm InGaAs DFB laser diode
transmission
- Simplex SC Connector
- Independence optical channel RoHS compliant and lead free
- -10℃ to 75℃ operating temperature
- Compliant with GR-468 reliability test standard
- 10 and 2.5 Gigabit hybrid Ethernet10G and 2.5G fiber hybrid channel
DESCRIPTION
The 1490nm 2.5G and 1577nm 10G I-temp DFB QOSA integrates two high-speed DFB laser diodes The 1490nm DFB LD has a monitor photodiode, and the 1577nm DFB LD has a monotor photodiode,TEC chip and EML chip.The QOSA has two independence APD or Pin-TIA to match two LD constructing four wavelength channels.The QOSA is designed for use in 10G small form-factor pluggable (XFP) transceivers and other types of optical modules for high-speed telecommunication and data applications.
APPLICATION
XGPON，XGSPON，GPON or 10GEPON，EPON Hybrid APPLICATION
ABSOLUTE MAXIMUM RATINGS(Tc=25°Cunless otherwise noted)
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device
These are absolute stress ratings only.Functional operation of the device is not implied at these or any other conditions in excess of those given in the operational sections of the data sheet. Exposure to absolute maximum ratings will cause permanent damage and/or adversely affect device reliability.
ELECTRICAL/OPTICAL CHARACTERISTICS
(Tc=25+3°C,SMF unless otherwise noted) For GPON OLT
(Tc=25±3°C, SMF unless otherwise noted) For XGPON OLT
OUTLINE DIAGRAM
CAUTIONS
Safety Cautions for Use of Optoelectronic Devices
General:
Although the manufacturer is always striving to improve the reliability of its product, problems and errors may occur with semiconductor products. Therefore, the user's products are required to be designed with full safety regard to prevent any accidents that results in injury, death, fire or environmental damage even when semiconductor products happen to error. Especially it is recommended to take in consideration about redundancy, fire prevention, error prevention safeguards. And the following requirements must be strictly observed.
Warning!
1. Eye safety: Semiconductor laser radiates laser light during operation. Laser light is very dangerous when shot directly into human eyes. Don't look at laser light directly, or through optics such as a lens. The laser light should be observed using the ITV camera, IR-viewer, or other appropriate instruments.
2. Product handling: The product contains GaAs (gallium arsenide). It is safe for regular use, but harmful to the human body if made into powder or steam. Be sure to avoid dangerous process like smashing, burning, chemical etching. Never put this product in one's mouth or swallow it.
3. Product disposal: This product must be disposed of as special industrial waste. It is necessary to separate it from general industrial waste and general garbage.
Handling Cautions for Optoelectronic Devices
1. General:
(1) The products described in this specification are designed and manufactured for use in general communication systems or electronic devices, unless their applications or reliability are otherwise specified. Therefore, they are not designed or manufactured for installation in devices or systems that may affect human life or that are used in social infrastructure requiring high reliability.
(2) When the customer is considering to use the products in special applications, such as transportation systems (automobiles, trains, vessels), medical equipments, aerospace, nuclear power control, and submarine repeaters or systems, please contact Electric or an authorized distributor.
2. Shipping Conditions:
(1) During shipment, place the packing boxes in the correct direction, and fix them firmly to keep them immovable. Placing the boxes upside down, tilting, or applying abnormal pressure onto them may cause deformation in the electrode terminals, breaking of optical fiber, or other problems.
(2) Never throw or drop the packing boxes. Hard impact on the boxes may cause break of the devices.
(3) Take strict precautions to keep the devices dry when shipping under rain or snow.
3. Storage Conditions:
When storing the products, it is recommended to store them following the conditions described below without opening the packing. Not taking enough care in storing may result in defects in electrical characteristics, soldering quality, visual appearance, and so on. The main points are described below (if special storage conditions are given to the product in the specification sheet, they have priority over the following general cautions):
(1) Appropriate temperature and humidity conditions, i.e., temperature range between 5~30°C, and humidity between 40~60 percent RH, should be maintained in storage locations. Controlling the temperature and humidity within this range is particularly important in case of long term storage for six months or more.
(2) The atmosphere should be particularly free from toxic gases and dust.
(3) Do not apply any load on the product.
(4) Do not cut or bend the leads of the devices which are to be stored. This is to prevent corrosion in the cut or bent part of the lead causing soldering problems in the customer’s assembling process. (5) Sudden change in temperature may cause condensation in the product or packing, therefore, such locations should be avoided for storing. Temperature in storage locations should be stable.
(6) When storing ceramic package products for extended periods of time, the leads may turn reddish due to reaction with sulfur in the atmosphere.
(7) Storage conditions for bare chip and unsealed products shall be stated separately because bare chip and unsealed products require stricter controls than package sealed products.
4. Design Conditions and Environment under Use:
(1) Avoid use in locations where water or organic solvents adhere directly to the product, or where there is any possibility of the generation of corrosive gas, explosive gas, dust, salinity, or other troublesome conditions. Such environments will not only significantly lower the reliability, but also may lead to serious accidents.
(2) Operation in excess of the absolute maximum ratings can cause permanent damage to the device. The customers are requested to design not to exceed those ratings even for a short time.
5. ESD Safety Cautions:
The optoelectronic devices are sensitive to static electricity (ESD, electro-static discharge). The product can be broken by ESD. When handling this product, please observe the following countermeasures: To prevent break of devices by static electricity or surge, please adopt the following countermeasures in the assembly line:
(1) Ground all equipments, machinery jigs, and tools in the process line with earth wires installed in them. Take particular care with hot plates, solder irons and other items for which the commercial power supplies are prone to leakage.
(2) Workers should always use earth bands. Use of antistatic clothing, electric conductive shoes, and other safety equipment while at work is highly recommended.
(3) Use conductive materials for this product’s container, etc.
(4) It is recommended that grounding mats be placed on the surfaces of assembly line workbench and the surrounding floor in work area, etc.
(5) When mounting this product in parts or materials which can be electrically charged (printed wiring boards, plastic products, etc.), pay close attention to the static electricity in those parts. ESD may damage the product.
(6) Humidity in working environment should be controlled to be 40 percent RH or higher. These countermeasures are most general, and there is a need to carefully confirm the line before starting mass production using this product (in the trial production, etc.). It is extremely important to prevent surge, eliminate it rapidly, and prevent it from spreading.
- 1490nm and 1577nm InGaAs DFB laser diode
transmission
- Simplex SC Connector
- Independence optical channel RoHS compliant and lead free
- -10℃ to 75℃ operating temperature
- Compliant with GR-468 reliability test standard
- 10 and 2.5 Gigabit hybrid Ethernet10G and 2.5G fiber hybrid channel
DESCRIPTION
The 1490nm 2.5G and 1577nm 10G I-temp DFB QOSA integrates two high-speed DFB laser diodes The 1490nm DFB LD has a monitor photodiode, and the 1577nm DFB LD has a monotor photodiode,TEC chip and EML chip.The QOSA has two independence APD or Pin-TIA to match two LD constructing four wavelength channels.The QOSA is designed for use in 10G small form-factor pluggable (XFP) transceivers and other types of optical modules for high-speed telecommunication and data applications.
APPLICATION
XGPON，XGSPON，GPON or 10GEPON，EPON Hybrid APPLICATION
ABSOLUTE MAXIMUM RATINGS(Tc=25°Cunless otherwise noted)
| Parameter | Symbol | Min. | Max. | Unit |
| Storage temperature | Tstg | -40 | 100 | ℃ |
| Operating temperature | Topr | -10 | 75 | ℃ |
| Forward current(LD) | lfld | 120 | mA | |
| Reverse voltage(LD) | Vrld | 2 | V | |
| Forward current(PD) | lfmd | 2 | mA | |
| Reverse voltage(PD,1490nm) | Vr | 20 | V | |
| Reverse voltage(PD1577nm) | Vr | 10 | V | |
| APD Break Down Voltage | Vbr | 33 | 55 | V |
| TEC Voltage | Vtec | 0.9 | V | |
| TEC Current | ltec | 0.6 | A |
These are absolute stress ratings only.Functional operation of the device is not implied at these or any other conditions in excess of those given in the operational sections of the data sheet. Exposure to absolute maximum ratings will cause permanent damage and/or adversely affect device reliability.
ELECTRICAL/OPTICAL CHARACTERISTICS
(Tc=25+3°C,SMF unless otherwise noted) For GPON OLT
| TRANSMITTER ELECTRA-OPTICAL CHARACTERISTICS | ||||||
| Parameters | Symbol | Measurement conditions | Min | Typical | Max | Units |
| Optical Wavelength | λ | CWlop=lth+20mA，Tc=25℃ | 1480 | 1490 | 1500 | nm |
| Spectral width | Δλ | CW,Tc=-10~85Clop=lth+20mA | 1 | nm | ||
| Side-mode suppression ratio | SMSR | CW,Tc=-20~85Clop=th+20mA | 35 | dB | ||
| Rise/Fall Time | Tr/Tf | lb=lth,20% to 80% | 0.1 | 0.2 | ns | |
| Laser threshold current | Tc=25℃ CW | 12 | mA | |||
| Tc=-10℃ to 85℃ CW | 48 | mA | ||||
| Operating voltage | Vf | CW,lop=lth+20mA | 1.1 | 1.5 | V | |
| Laser average outputoptical power | Po | Tc=25℃ CW,lop=th+20mA | 2.5 | 3 | mW | |
| Tc=-10~85℃ CW,lop=lth+20mA | 1.8 | mW | ||||
| Slope Efficiency | SE | CW,lop=lth+20mA | 0.14 | 0.25 | mW/mA | |
| T=25℃ | ||||||
| T=85℃ | 0.09 | 1 | mW/mA | |||
| Monitor current | lm | CW,Tc=-10~85℃ | 1.1 | mW | ||
| MPD dark current | ld | Vrd=5V | 100 | nA | ||
| MPD Capacitance | Ct | Vrd=5V,f=1MHz | 10 | 20 | pF | |
| The tracking error | TE | Tc=-10℃ to85℃CWAPC TE=10log(Pf(TC)/Pf(25℃)) | -1.5 | 1.5 | dB | |
| RECEIVER ELECTRA-OPTICAL CHARACTERISTICS | ||||||
| Operating Wavelength | λ | Tc=-10℃ to 85℃ | 1290 | 1330 | nm | |
| Supply Voltage | Vcc | Tc=-10℃ to 85℃ | 3 | 3.3 | 3.6 | V |
| Supply Current | Icc | Tc=-10℃ to 85℃ | 25 | mA | ||
| APD Breakdown Voltage | Vbr | Id=10uA，TIA on，Tc=-10℃ to 85℃ |
20 | 55 | V | |
| APD Operating Voltage | Vop | Vbr-3 | V | |||
| APD Vbr Temperature coefficient | Tc=-10℃ to 85℃ | 0.06 | 0.1 | 0.13 | V/℃ | |
| Optical sensitivity | Sen | Tc=-10℃to 85℃ AC, RL=50Ω, NRZ, 1.25Gbps, PRBS=2^31-1 Extinction ratio: 10dB BER=10-10, λ=1290~1330nm |
-32 | dBm | ||
| Saturation Power | Psat | -6 | dBm | |||
| APD Capacitance | Cpd | Vr=0.9*Vbr, 1MHz | 0.4 | pF | ||
| Output Impedance | Z | Single end | 40 | 50 | 60 | Ω |
| Responsivity | R | CW, λ=1310，M=1 | 0.7 | 0.8 | A/W | |
| Differential Output Swing | Vout |
RL=50 ohms | 300 | 1000 | mVp-p | |
| Other characteristics | ||||||
| Optical Return Loss Tolerance | RL | λ= 1490nm | -10 | dB | ||
| λ= 1310nm | -20 | dB | ||||
| Optical Crosstalk | Xopt | 1490nm Internal TX/1310nm RX | -45 | dB | ||
(Tc=25±3°C, SMF unless otherwise noted) For XGPON OLT
| TRANSMITTER ELECTRA-OPTICAL CHARACTERISTICS | ||||||
| Parameters | Symbol | Measurement conditions | Min | Typical | Max | Units |
| Optical Wavelength | λ | CW, Top | 1575 | 1577 | 1580 | nm |
| Spectral width | Δλ | CW | 1 | nm | ||
| Side-mode suppression ratio | SMSR | CW | 35 | dB | ||
| Center Wavelength Tuning Coefficient | 0.13 | nm/℃ | ||||
| Rise/Fall Time | Tr/Tf | Ib=Ith, 20% to 80% | 30 | ps | ||
| Laser Operating Temperature | Top | 40 | 50 | ℃ | ||
| Laser threshold current | Ith | Tc=-10℃ to 85℃，CW | 30 | mA | ||
| Operating voltage | Vf | Iop，Top | 2 | V | ||
| Laser average output optical power | Pf | Tc=45ºC, CW, Iop =100mA@EA=0v | 4.5 | 5.5 | mW | |
| EA Center-point Bias Voltage | Vea | -2 | 0 | V | ||
| P-P Modulation Voltage (EA Section) | Vpp | 2.5 | V | |||
| Operating current | Iop | 90 | 120 | mA | ||
| Slope Efficiency | SE | VEA=0V, Top=45℃ | 0.067 | mW/mA | ||
| Monitor current | Im | CW,Tc=-10~85ºC | 0.1 | 1 | mA | |
| MPD dark current | Id | Vrd=5V | 100 | nA | ||
| MPD Capacitance | Vrd=5V, f=1MHz | 10 | 20 | pF | ||
| The tracking error | Tc=-10℃ to 85℃,CW, APC TE=10log(Pf(TC)/Pf(25℃)) |
-1.5 | 1.5 | dB | ||
| RECEIVER ELECTRO-OPTICAL CHARACTERISTICS | ||||||
| Operating Wavelength | λ | Tc=-10℃ to 85℃ | 1260 | 1280 | nm | |
| Supply Voltage | Vcc | Tc=-10℃ to 85℃ | 3 | 3.3 | 3.6 | V |
| Supply Current | Icc | Tc=-10℃ to 85℃ | 25 | mA | ||
| APD Breakdown Voltage | Vbr | Id=10uA，TIA on，Tc=-10℃ to 85℃ |
20 | 60 | V | |
| APD Operating Voltage | Vop | Vbr-3 | V | |||
| APD Vbr Temperature coefficient | Tc=-10℃ to 85℃ | 0.06 | 0.1 | 0.13 | V/℃ | |
| Optical sensitivity | Sen | Tc=-10℃ to 85℃ AC, RL=50Ω, NRZ, 2.5Gbps, PRBS=2^31-1 Extinction ratio:8.2dB BER=10-4, λ =1260~1280nm |
-30 | dBm | ||
| Saturation Power | Psat | -7 | dBm | |||
| APD Capacitance | Cpd | Vr=0.9*Vbr, 1MHz | 0.4 | pF | ||
| Output Impedance | Z | Single end | 40 | 50 | 60 | Ω |
| Responsivity | R | CW, λ=1310，M=1 | 0.7 | 0.8 | A/W | |
| Differential Output Swing | Vout |
RL=50 ohms | 300 | 1000 | mVp-p | |
| Other characteristics | ||||||
| Optical Return Loss Tolerance | RL | λ= 1577nm | -10 | dB | ||
| λ= 1270nm | -20 | dB | ||||
| Optical Crosstalk | Xopt | 1577nm Internal TX/1270nm RX | -45 | dB | ||
| GPON/XGPON characteristics | ||||||
| Optical Isolation from | ISO | 1270nm/1310nm | 30 | dB | ||
| External Source | ||||||
OUTLINE DIAGRAM
CAUTIONS
Safety Cautions for Use of Optoelectronic Devices
General:
Although the manufacturer is always striving to improve the reliability of its product, problems and errors may occur with semiconductor products. Therefore, the user's products are required to be designed with full safety regard to prevent any accidents that results in injury, death, fire or environmental damage even when semiconductor products happen to error. Especially it is recommended to take in consideration about redundancy, fire prevention, error prevention safeguards. And the following requirements must be strictly observed.
Warning!
1. Eye safety: Semiconductor laser radiates laser light during operation. Laser light is very dangerous when shot directly into human eyes. Don't look at laser light directly, or through optics such as a lens. The laser light should be observed using the ITV camera, IR-viewer, or other appropriate instruments.
2. Product handling: The product contains GaAs (gallium arsenide). It is safe for regular use, but harmful to the human body if made into powder or steam. Be sure to avoid dangerous process like smashing, burning, chemical etching. Never put this product in one's mouth or swallow it.
3. Product disposal: This product must be disposed of as special industrial waste. It is necessary to separate it from general industrial waste and general garbage.
Handling Cautions for Optoelectronic Devices
1. General:
(1) The products described in this specification are designed and manufactured for use in general communication systems or electronic devices, unless their applications or reliability are otherwise specified. Therefore, they are not designed or manufactured for installation in devices or systems that may affect human life or that are used in social infrastructure requiring high reliability.
(2) When the customer is considering to use the products in special applications, such as transportation systems (automobiles, trains, vessels), medical equipments, aerospace, nuclear power control, and submarine repeaters or systems, please contact Electric or an authorized distributor.
2. Shipping Conditions:
(1) During shipment, place the packing boxes in the correct direction, and fix them firmly to keep them immovable. Placing the boxes upside down, tilting, or applying abnormal pressure onto them may cause deformation in the electrode terminals, breaking of optical fiber, or other problems.
(2) Never throw or drop the packing boxes. Hard impact on the boxes may cause break of the devices.
(3) Take strict precautions to keep the devices dry when shipping under rain or snow.
3. Storage Conditions:
When storing the products, it is recommended to store them following the conditions described below without opening the packing. Not taking enough care in storing may result in defects in electrical characteristics, soldering quality, visual appearance, and so on. The main points are described below (if special storage conditions are given to the product in the specification sheet, they have priority over the following general cautions):
(1) Appropriate temperature and humidity conditions, i.e., temperature range between 5~30°C, and humidity between 40~60 percent RH, should be maintained in storage locations. Controlling the temperature and humidity within this range is particularly important in case of long term storage for six months or more.
(2) The atmosphere should be particularly free from toxic gases and dust.
(3) Do not apply any load on the product.
(4) Do not cut or bend the leads of the devices which are to be stored. This is to prevent corrosion in the cut or bent part of the lead causing soldering problems in the customer’s assembling process. (5) Sudden change in temperature may cause condensation in the product or packing, therefore, such locations should be avoided for storing. Temperature in storage locations should be stable.
(6) When storing ceramic package products for extended periods of time, the leads may turn reddish due to reaction with sulfur in the atmosphere.
(7) Storage conditions for bare chip and unsealed products shall be stated separately because bare chip and unsealed products require stricter controls than package sealed products.
4. Design Conditions and Environment under Use:
(1) Avoid use in locations where water or organic solvents adhere directly to the product, or where there is any possibility of the generation of corrosive gas, explosive gas, dust, salinity, or other troublesome conditions. Such environments will not only significantly lower the reliability, but also may lead to serious accidents.
(2) Operation in excess of the absolute maximum ratings can cause permanent damage to the device. The customers are requested to design not to exceed those ratings even for a short time.
5. ESD Safety Cautions:
The optoelectronic devices are sensitive to static electricity (ESD, electro-static discharge). The product can be broken by ESD. When handling this product, please observe the following countermeasures: To prevent break of devices by static electricity or surge, please adopt the following countermeasures in the assembly line:
(1) Ground all equipments, machinery jigs, and tools in the process line with earth wires installed in them. Take particular care with hot plates, solder irons and other items for which the commercial power supplies are prone to leakage.
(2) Workers should always use earth bands. Use of antistatic clothing, electric conductive shoes, and other safety equipment while at work is highly recommended.
(3) Use conductive materials for this product’s container, etc.
(4) It is recommended that grounding mats be placed on the surfaces of assembly line workbench and the surrounding floor in work area, etc.
(5) When mounting this product in parts or materials which can be electrically charged (printed wiring boards, plastic products, etc.), pay close attention to the static electricity in those parts. ESD may damage the product.
(6) Humidity in working environment should be controlled to be 40 percent RH or higher. These countermeasures are most general, and there is a need to carefully confirm the line before starting mass production using this product (in the trial production, etc.). It is extremely important to prevent surge, eliminate it rapidly, and prevent it from spreading.